METHOD OF PRODUCING HIGH TEMPERATURE HEAT RESISTANT ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND HIGH TEMPERATURE HEAT RESISTANT ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL OBTAINED BY THE PRODUCTION METHOD

• Main Authors: SUGIMOTO AKIKO, TAKANASHI TETSUAKI, DOBASHI MAKOTO, OBATA SHINICHI, IWAKIRI KENICHIRO, YOSHIOKA ATSUSHI
• Format: Patent
• Language: English
• Published: 19.11.2003
• Edition: 7
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a method of producing high temperature heat resistant electrolytic copper foil with carrier foil by which the carrier foil can easily be peeled even when press working is performed at ≥200°C. SOLUTION: An organic joint boundary face layer is formed on the surface of carrier foil by using an organic agent. An electrolytic copper foil layer is then formed on the organic joint boundary face layer. In the production method, the organic joint boundary face is formed on the surface of the carrier foil as a pickling adsorption organic film in such a manner that, while the surface of the carrier foil is pickled and dissolved with a pickling solution containing a 50 to 2,000 ppm organic agent used for the formation of the joint boundary face layer, the organic agent is simultaneously allowed to be adsorbed thereon. COPYRIGHT: (C)2004,JPO