METHOD AND APPARATUS FOR MEASURING THERMAL CAPACITY OF COMPONENT

• Main Authors: KIKUCHI SHUNICHI, AZUMA SHUJI, YAMAMOTO TAKESHI, IKETAKI KENJI, YAMADA MITSUTAKA
• Format: Patent
• Language: English
• Published: 15.10.2003
• Edition: 7
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

PROBLEM TO BE SOLVED: To provide a thermal capacity measurement method and a thermal capacity measurement apparatus for measuring a thermal capacity of a component which put the component in a container with a small thermal capacity, fill a cooling medium at a fixed temperature into the container, measure an equilibrium temperature, simply, easily and rapidly measure the thermal capacity of the component, and reduce a temperature difference on a printed board based on a measurement value when processed by reflow soldering. SOLUTION: The thermal capacity measurement method has a step for measuring weight of the component and heating the component until a predetermined temperature T1; a step for measuring weight of the cooling medium and heating the cooling medium until a predetermined temperature T2; a step for putting the component in the container and filling the cooling medium into the container; a step for measuring a temperature of the component, the filled cooling medium or the container, and detecting the equilibrium temperature; and a step for calculating the thermal capacity of the component based on the measured equilibrium temperature, the weight of the component, the predetermined temperature T1; the weight the weight of the cooling medium, and the predetermined temperature T2. COPYRIGHT: (C)2004,JPO