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Summary:PROBLEM TO BE SOLVED: To provide a method for heat treating a substrate which does not cause warp or distortion by heating. SOLUTION: The method for heat treating a plastic substrate by putting a plastic sheet 6 in between the plastic substrate 5 and a flat base 7 to place the plastic substrate, which is characterized in that a relational expression T0<T1<T2 applies among T0: heat conductivity of the plastic substrate, T1: heat conductivity of the plastic sheet and T2: heat conductivity of the upper surface of the flat base. COPYRIGHT: (C)2004,JPO
Bibliography:Application Number: JP20020104115