SEMICONDUCTOR DEVICE WITH BUILT-IN CONTACT-TYPE SENSOR AND MANUFACTURING METHOD THEREOF

• Main Authors: SAKOTA EIJI, TANIGUCHI FUMIHIKO
• Format: Patent
• Language: English
• Published: 03.10.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTING; COUNTING; DIAGNOSIS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING RECORD CARRIERS; HUMAN NECESSITIES; HYGIENE; IDENTIFICATION; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; MEDICAL OR VETERINARY SCIENCE; PHYSICS; PRESENTATION OF DATA; RECOGNITION OF DATA; RECORD CARRIERS; SEMICONDUCTOR DEVICES; SURGERY; TESTING

PROBLEM TO BE SOLVED: To provide a semiconductor device with a built-in contact-type sensor in which a height around a sensor part from the exposed surface of the sensor part can be reduced, and to provide a manufacturing method thereof. SOLUTION: A semiconductor chip 22 has a fingerprint sensor 21 formed on a circuit forming surface 22a, and an electrode 22b. A through-via 24 penetrating the electrode 22b and the semiconductor chip 22 is extended to a back side electrode 23 formed on the back surface 22c of the chip 22. The back side electrode 23 is connected to a solder ball 7 which is an external connection terminal. The circuit forming surface 22a of the semiconductor chip is covered with a thin protection film 25 in a state that the fingerprint sensor 21 is exposed. COPYRIGHT: (C)2004,JPO