SEMICONDUCTOR DEVICE WITH BUILT-IN CONTACT-TYPE SENSOR AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a semiconductor device with a built-in contact-type sensor in which a height around a sensor part from the exposed surface of the sensor part can be reduced, and to provide a manufacturing method thereof. SOLUTION: A semiconductor chip 22 has a fingerprint sensor 21...

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Bibliographic Details
Main Authors SAKOTA EIJI, TANIGUCHI FUMIHIKO
Format Patent
LanguageEnglish
Published 03.10.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
DIAGNOSIS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING RECORD CARRIERS
HUMAN NECESSITIES
HYGIENE
IDENTIFICATION
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
MEDICAL OR VETERINARY SCIENCE
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
SURGERY
TESTING
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device with a built-in contact-type sensor in which a height around a sensor part from the exposed surface of the sensor part can be reduced, and to provide a manufacturing method thereof. SOLUTION: A semiconductor chip 22 has a fingerprint sensor 21 formed on a circuit forming surface 22a, and an electrode 22b. A through-via 24 penetrating the electrode 22b and the semiconductor chip 22 is extended to a back side electrode 23 formed on the back surface 22c of the chip 22. The back side electrode 23 is connected to a solder ball 7 which is an external connection terminal. The circuit forming surface 22a of the semiconductor chip is covered with a thin protection film 25 in a state that the fingerprint sensor 21 is exposed. COPYRIGHT: (C)2004,JPO
Bibliography:Application Number: JP20020079246