MULTILAYERED PRINTED BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To make another wiring which is not connected electrically to internal circuits passable through a via hole in which the internal circuits are connected to each other in a build-up multilayered printed board. SOLUTION: The multilayered printed board includes at least two layers...

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Bibliographic Details
Main Author AKAI SHINICHI
Format Patent
LanguageEnglish
Published 12.09.2003
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To make another wiring which is not connected electrically to internal circuits passable through a via hole in which the internal circuits are connected to each other in a build-up multilayered printed board. SOLUTION: The multilayered printed board includes at least two layers of a printed board 10 used as a core material having first circuit wiring 11 which becomes one internal circuit on its surface and an insulating resin layer 20 formed on the wiring 11. At the time of electrically connecting second circuit wiring 31 formed on the resin layer 20 to the first circuit wiring 11 of the board 10 through a via hole 21 formed by a laser beam, the via hole 21 is formed in a cone-shaped hole and the connecting terminal section 31a of the second circuit wiring 31 is connected to the first circuit wiring 11 through part of the internal surface of the cone-shaped via hole 21 so that the other wiring 32 which is not connected electrically to the second circuit wiring 31 is passed through the remaining part of the cone-shaped hole 21. COPYRIGHT: (C)2003,JPO
Bibliography:Application Number: JP20020054749