SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To reduce production cost, while enhancing heat dissipation properties by simplifying insulation arrangement or heat transfer arrangement. SOLUTION: The semiconductor device 11 comprises a first metal body 13 bonded to the back side of a semiconductor element 12 and serving as...

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Bibliographic Details
Main Authors HIRANO NAOHIKO, TEJIMA TAKANORI, NAKASE YOSHIMI, MIURA SHOJI
Format Patent
LanguageEnglish
Published 12.09.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To reduce production cost, while enhancing heat dissipation properties by simplifying insulation arrangement or heat transfer arrangement. SOLUTION: The semiconductor device 11 comprises a first metal body 13 bonded to the back side of a semiconductor element 12 and serving as an electrode and a heat dissipation, a second metal body 14 bonded to the surface side of the semiconductor element 12 and serving as an electrode and a heat dissipation, where the entire body is molded body resin 17. The first metal body 13 and the second metal body 14 are exposed to one planar part 19 of the molding 18. According to the arrangement, insulation arrangement or heat transfer arrangement is required only for the first metal body 13 and for the second metal body 14 exposed to one planar part 19 of the molding 18. COPYRIGHT: (C)2003,JPO
Bibliography:Application Number: JP20020312615