BUMP MANUFACTURING DEVICE

PROBLEM TO BE SOLVED: To obtain an inexpensive bump manufacturing method which enables a bump to be manufactured in an electrode part on a wafer or a circuit board by using ball-like conductive particles of prescribed dimensional accuracy and its device. SOLUTION: The bump manufacturing device has a...

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Bibliographic Details
Main Authors ITSUJI TAKAYUKI, NAKATSUKA TETSUYA, MATSUI ATSUSHI, UCHIYAMA KAORU, MUKUNO HIDEKI
Format Patent
LanguageEnglish
Published 12.09.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To obtain an inexpensive bump manufacturing method which enables a bump to be manufactured in an electrode part on a wafer or a circuit board by using ball-like conductive particles of prescribed dimensional accuracy and its device. SOLUTION: The bump manufacturing device has an air blow unit in the periphery of a supply device in a device composed of a process for aligning a mask with a through hole and a wafer in a bump manufacturing position, a ball mounting process having the supply device which moves while dropping conductive particles to the through hole on the mask and a ball connection process for collecting conductive particles which are dropped outside the mask through hole. COPYRIGHT: (C)2003,JPO
Bibliography:Application Number: JP20020059655