PACKAGE FOR SURFACE ACOUSTIC WAVE FILTER

PROBLEM TO BE SOLVED: To solve the problem of a common ground conductor layer 2 being connected to an external electric circuit connecting ground conductor 11 through through-conductors 9 each having a high aspect ratio and hence a high inductance, this causing isolation between input/output wirings...

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Bibliographic Details
Main Author KAWAMURA MASAHARU
Format Patent
LanguageEnglish
Published 05.09.2003
Edition7
Subjects
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Summary:PROBLEM TO BE SOLVED: To solve the problem of a common ground conductor layer 2 being connected to an external electric circuit connecting ground conductor 11 through through-conductors 9 each having a high aspect ratio and hence a high inductance, this causing isolation between input/output wirings to be deteriorated. SOLUTION: The elastic surface wave filter package has a ground conductor layer 12 connected to a ground conductor 21 through through-conductors 19 satisfying that L<2r, wherein r and L are respectively the radius and the length of the conductor 19. The aspect ratio of the conductor 19 from the common ground conductor layer 12 to the external electric circuit connecting ground conductor 21 is reduced to decrease its inductance, thereby improving attenuation in a high-frequency rejection band and the isolation between input/output wirings 13, 13. COPYRIGHT: (C)2003,JPO
Bibliography:Application Number: JP20020048833