SUBSTRATE PROCESSING SYSTEM

• Main Authors: TATENO HIDETO, TAKESHITA MITSUNORI
• Format: Patent
• Language: English
• Published: 29.08.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a substrate processing system in which a temperature can be controlled using water and production of by-products can be prevented while sustaining the performance at the magnetic seal part. SOLUTION: The substrate processing system comprises a heat treatment furnace 50, a seal cap 1 for enclosing the heat treatment furnace 50, a flange 2 under the seal cap 1, bolts 12 for supporting a substrate, a shaft 4 penetrating the seal cap 1 and rotating the bolts 12, and a magnetic seal part 3 fixed to the shaft 4. The magnetic seal part 3 is fixed beneath the flange 2. A water cooling jacket 7 is wound around the housing 5 of the magnetic seal part 3 and the magnetic seal part 3 is cooled by supplying water to the water cooling jacket 7. A thermocouple 8 and a thermoswitch 9 are fixed to the housing 5 in order to control the temperature of the seal cap not lower than a level where by-products are produced by the reaction gas and to control the temperature of the magnetic seal part 3 not higher than the heat resistant level thereof. COPYRIGHT: (C)2003,JPO