SUBSTRATE PROCESSING SYSTEM

PROBLEM TO BE SOLVED: To provide a substrate processing system in which a temperature can be controlled using water and production of by-products can be prevented while sustaining the performance at the magnetic seal part. SOLUTION: The substrate processing system comprises a heat treatment furnace...

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Bibliographic Details
Main Authors TATENO HIDETO, TAKESHITA MITSUNORI
Format Patent
LanguageEnglish
Published 29.08.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a substrate processing system in which a temperature can be controlled using water and production of by-products can be prevented while sustaining the performance at the magnetic seal part. SOLUTION: The substrate processing system comprises a heat treatment furnace 50, a seal cap 1 for enclosing the heat treatment furnace 50, a flange 2 under the seal cap 1, bolts 12 for supporting a substrate, a shaft 4 penetrating the seal cap 1 and rotating the bolts 12, and a magnetic seal part 3 fixed to the shaft 4. The magnetic seal part 3 is fixed beneath the flange 2. A water cooling jacket 7 is wound around the housing 5 of the magnetic seal part 3 and the magnetic seal part 3 is cooled by supplying water to the water cooling jacket 7. A thermocouple 8 and a thermoswitch 9 are fixed to the housing 5 in order to control the temperature of the seal cap not lower than a level where by-products are produced by the reaction gas and to control the temperature of the magnetic seal part 3 not higher than the heat resistant level thereof. COPYRIGHT: (C)2003,JPO
Bibliography:Application Number: JP20020037743