TEMPLATE FOR POLISHING

PROBLEM TO BE SOLVED: To provide a template for polishing for improving polishing efficiency compared with the prior art. SOLUTION: The template 1 for polishing engages a polishing object 2 and polishes its surface. Its outer peripheral edge 8 is chamfered by about 20 to 70° in relation to polishing...

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Bibliographic Details
Main Authors TSUTSUI HIROMASA, MATSUMURA SHINICHI
Format Patent
LanguageEnglish
Published 26.08.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a template for polishing for improving polishing efficiency compared with the prior art. SOLUTION: The template 1 for polishing engages a polishing object 2 and polishes its surface. Its outer peripheral edge 8 is chamfered by about 20 to 70° in relation to polishing work surface 9. Thus, polishing slurry easily flows from the outer peripheral edge to the polishing work surface. A polishing cloth does not contact with an edge at the proximity region of the outer peripheral edge, so that occurrence of contamination by damage to the edge part and scratch through the polishing cloth can be prevented during the polishing of the polished material. COPYRIGHT: (C)2003,JPO
Bibliography:Application Number: JP20020038634