CIRCUIT BOARD AND METHOD OF TESTING DEFECTIVE SOLDERING

• Main Author: SUZUKI HIDENOBU
• Format: Patent
• Language: English
• Published: 22.08.2003
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To facilitate a inspection for defective soldering. SOLUTION: Between a land 3 and a wiring pattern 4, a space 5 is formed. By soldering a terminal 6 to the land 3, a conductive path is formed between the land 3 and the wiring pattern 4 by solder 7. In an inspection test by tur...