CIRCUIT BOARD AND METHOD OF TESTING DEFECTIVE SOLDERING

• Main Author: SUZUKI HIDENOBU
• Format: Patent
• Language: English
• Published: 22.08.2003
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To facilitate a inspection for defective soldering. SOLUTION: Between a land 3 and a wiring pattern 4, a space 5 is formed. By soldering a terminal 6 to the land 3, a conductive path is formed between the land 3 and the wiring pattern 4 by solder 7. In an inspection test by turning on electricity for the wiring pattern 4, if there is defective soldering such as insufficient strength due to lack of solder amount and failure to solder, the solder 7 will not allow a conductive path between the land 3 and the wiring pattern 4 and soldering with regard to the land 3 is detected as being 'open'. When soldering is properly done, the solder 7 forms the conductive path between the land 3 and the wiring pattern 4 and soldering with regard to the land 3 is detected as continuity. By using the fact that soldering with regard to the land 3 is detected as being continuous as a sufficient condition, propriety of soldering can be estimated with high probability. COPYRIGHT: (C)2003,JPO