SUBSTRATE DRYING EQUIPMENT

PROBLEM TO BE SOLVED: To provide substrate drying equipment in which solution applied to the upper surface of a substrate can be heated and dried uniformly. SOLUTION: The substrate drying equipment for forming a functional thin film by heating and drying solution applied to the upper surface of a su...

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Bibliographic Details
Main Author SHIGEYAMA AKIHIRO
Format Patent
LanguageEnglish
Published 08.08.2003
Edition7
Subjects
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Summary:PROBLEM TO BE SOLVED: To provide substrate drying equipment in which solution applied to the upper surface of a substrate can be heated and dried uniformly. SOLUTION: The substrate drying equipment for forming a functional thin film by heating and drying solution applied to the upper surface of a substrate W comprises supporting pins 3 each having an upper end formed into an acute supporting part 3a for supporting the wafer W, and an infrared lamp 4 disposed on the upper surface side of the wafer W supported by the supporting pins and heating and drying solution applied to the upper surface of the substrate W. COPYRIGHT: (C)2003,JPO
Bibliography:Application Number: JP20020020404