SUBSTRATE DRYING EQUIPMENT

PROBLEM TO BE SOLVED: To provide substrate drying equipment in which solution applied to the upper surface of a substrate can be heated and dried uniformly. SOLUTION: The substrate drying equipment for forming a functional thin film by heating and drying solution applied to the upper surface of a su...

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Bibliographic Details
Main Author SHIGEYAMA AKIHIRO
Format Patent
LanguageEnglish
Published 08.08.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
DRYING
DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEATING
LIGHTING
MECHANICAL ENGINEERING
SEMICONDUCTOR DEVICES
WEAPONS
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Summary:PROBLEM TO BE SOLVED: To provide substrate drying equipment in which solution applied to the upper surface of a substrate can be heated and dried uniformly. SOLUTION: The substrate drying equipment for forming a functional thin film by heating and drying solution applied to the upper surface of a substrate W comprises supporting pins 3 each having an upper end formed into an acute supporting part 3a for supporting the wafer W, and an infrared lamp 4 disposed on the upper surface side of the wafer W supported by the supporting pins and heating and drying solution applied to the upper surface of the substrate W. COPYRIGHT: (C)2003,JPO
Bibliography:Application Number: JP20020020404