PREPREG, METAL-CLAD LAMINATED PLATE AND PRINTED WIRING PLATE USING THE SAME

• Main Authors: OSE MASAHISA, AITSU SHUJI
• Format: Patent
• Language: English
• Published: 30.07.2003
• Edition: 7
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

PROBLEM TO BE SOLVED: To provide a prepreg that has excellent appearance with the occurrence of pin holes suppressed and shows excellent drilling processability, when the prepregs are laminated, and provide metal-clad laminated plates and printed wiring plate using the same. SOLUTION: The backing materials (substrates) are impregnated with a resin composition to prepare the prepregs. In this case, the substrate is glass fiber-woven fabric having the air permeability of 1-65 cm3/cm2/sec and the thickness of 20-100 μm, the resin composition includes inorganic filler and silicone polymer wherein the amount of the inorganic filler is ≥25 vol.% on the basis of the total solid components. The resultant prepregs or their laminates are clad with metal foil on one face or both faces. Finally, the printed wired boards are obtained by printing the wiring on the metal-clad laminated boards. COPYRIGHT: (C)2003,JPO