PACKAGE FOR ACOUSTIC SURFACE WAVE FILTER

• Main Authors: KAWAMURA MASAHARU, IKEDA KOTA
• Format: Patent
• Language: English
• Published: 11.07.2003
• Edition: 7
• Subjects: BASIC ELECTRONIC CIRCUITRY; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS

PROBLEM TO BE SOLVED: To solve the problem of a conventional package such as that the LC resonance with the capacitance components that an acoustic surface wave filter element and the package have occurs, which incurs the deterioration of the isolation property between signal lines, since it is of such structure that the two or more grounding electrodes of the acoustic surface wave filter element are connected with each other via inductance components. SOLUTION: It is possible to remove the electric conductivity of the ground conductor within the package, and eliminate the inductance components since at least two grounding conductor layers 12 are arranged within an insulating substrate 11. At least the two grounding electrodes of the elastic surface wave filter element 17 are severally connected to the ground conductor, and besides are electrically connected severally to the grounding conductors of an external electric circuit. The LC resonance with the capacitance components that the acoustic surface wave filter element 17 and the package have can be suppressed, and it becomes possible to improve the quantity of attenuation in a checking area turned into high frequency and the deterioration of the isolation between input and output distributing wires 13 and 13. COPYRIGHT: (C)2003,JPO