ANTENNA-INTEGRATED PACKAGE

PROBLEM TO BE SOLVED: To provide a high frequency semiconductor-antenna-integrated package, which effectively utilizes a lead frame used in a package product as a part of an antenna, a coil and a capacitor in frequency bands extending from several GHz to 30 GHz to perform a high efficiency radiation...

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Bibliographic Details
Main Author OSADA NAOYUKI
Format Patent
LanguageEnglish
Published 11.07.2003
Edition7
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
TRANSMISSION
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Summary:PROBLEM TO BE SOLVED: To provide a high frequency semiconductor-antenna-integrated package, which effectively utilizes a lead frame used in a package product as a part of an antenna, a coil and a capacitor in frequency bands extending from several GHz to 30 GHz to perform a high efficiency radiation, while miniaturizing the structure and reducing the number of peripheral components and the cost by the known technology. SOLUTION: The antenna-integrated package 1, having a micro/millimeter wave IC 3 having active and passive elements and an antenna part 2, uses a part of a lead frame 26 constituting the micro/millimeter wave IC as an antenna 4. COPYRIGHT: (C)2003,JPO
Bibliography:Application Number: JP20010394295