METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND MOUNTING METHOD THEREOF

• Main Authors: MATSUKI HIROHISA, NIIMA YASUHIRO, KAWAHARA TOSHISANE, MARUYAMA SHIGEYUKI, FUKAZAWA NORIO, KASAI JUNICHI, MORIOKA MUNETOMO, ONODERA MASANORI, SUZUKI YOSHIMI, OOSAWA MITSUHIRO, SAKUMA MASAO
• Format: Patent
• Language: English
• Published: 11.07.2003
• Edition: 7
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To improve the manufacturing efficiency and reliability of a semiconductor device in a method of manufacturing a semiconductor device having a chip size package structure, a mold for manufacturing the semiconductor device, the semiconductor device, and a mounting method thereof. SOLUTION: A substrate 16, on which a plurality of semiconductor elements 11 are formed, is mounted in a cavity 28 of a mold 20. Bumps 12 are formed on the semiconductor elements 11. Further, the method comprises a resin sealing step of supplying resin 35 to placing positions of the bumps 12 to seal the bumps 12 and form a resin layer 13, a protruding electrode exposing step of exposing at least ends of the bumps 12, from the resin layer 13 which are covered with the resin layer 13 and a dividing step of cutting the substrate 16 together with the resin layer 13 to divide the substrate 16 and the resin layer 13 into the individual semiconductor elements 11. COPYRIGHT: (C)2003,JPO