SEALING APPARATUS FOR SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a resin sealing apparatus having low-cost and small-size in which the temperature of a substrate is not remarkably lowered during a period until a preheated substrate is set in a mold or an unevenness does not occur at the temperature of the substrate. SOLUTION: The...
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Main Author | |
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Format | Patent |
Language | English |
Published |
27.06.2003
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a resin sealing apparatus having low-cost and small-size in which the temperature of a substrate is not remarkably lowered during a period until a preheated substrate is set in a mold or an unevenness does not occur at the temperature of the substrate. SOLUTION: The sealing apparatus for a semiconductor device comprises movable preheaters 31A, 31B having guide rods 32, 32, timing belts 33a, 33b and servo motors 35a, 35b for constituting a special purpose movable preheater drive mechanism so as to reciprocate to the vicinity of the molds 4A, 4B, 4C and 4D. COPYRIGHT: (C)2003,JPO |
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Bibliography: | Application Number: JP20020301886 |