SEALING APPARATUS FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a resin sealing apparatus having low-cost and small-size in which the temperature of a substrate is not remarkably lowered during a period until a preheated substrate is set in a mold or an unevenness does not occur at the temperature of the substrate. SOLUTION: The...

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Bibliographic Details
Main Author OGATA KENJI
Format Patent
LanguageEnglish
Published 27.06.2003
Edition7
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:PROBLEM TO BE SOLVED: To provide a resin sealing apparatus having low-cost and small-size in which the temperature of a substrate is not remarkably lowered during a period until a preheated substrate is set in a mold or an unevenness does not occur at the temperature of the substrate. SOLUTION: The sealing apparatus for a semiconductor device comprises movable preheaters 31A, 31B having guide rods 32, 32, timing belts 33a, 33b and servo motors 35a, 35b for constituting a special purpose movable preheater drive mechanism so as to reciprocate to the vicinity of the molds 4A, 4B, 4C and 4D. COPYRIGHT: (C)2003,JPO
Bibliography:Application Number: JP20020301886