OPTICAL WIRING CIRCUIT, OPTICAL WIRING CIRCUIT LAMINATE AND PHOTOELECTRIC WIRING APPARATUS

PROBLEM TO BE SOLVED: To provide an optical wiring circuit which can be connected to an arbitrary circuit board, can reduce in the area of an optical wiring part and can be wholly miniaturized and an optical wiring circuit laminate with a plurality of the optical wiring circuits laminated. SOLUTION:...

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Main Authors KOBAYASHI KENICHI, TAKANASHI TADASHI, YAMADA HIDENORI, BABA TOMOO, FUNADA MASAO, MIURA MASAAKI, KYOZUKA SHINYA, OKADA JUNJI, SAKASAI KAZUHIRO, KOSEKI SHINOBU, TOJIMA AKIRA, NIITSU TAKEHIRO, HISADA SHOJI, HAMADA TSUTOMU, KAMIMURA TAKESHI
Format Patent
LanguageEnglish
Published 06.06.2003
Edition7
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Summary:PROBLEM TO BE SOLVED: To provide an optical wiring circuit which can be connected to an arbitrary circuit board, can reduce in the area of an optical wiring part and can be wholly miniaturized and an optical wiring circuit laminate with a plurality of the optical wiring circuits laminated. SOLUTION: A photoelectric wiring apparatus 10 comprises the optical wiring circuit stacking element 12 and electric wiring boards 14. The optical wiring circuit stacking element 12 has a plurality of the stacked optical wiring circuits 16. The optical wiring circuit comprises a translucent medium 20, a reflection part 22 and an optical fiber 24. The reflection part 22 is provided on a first end face 20a of the translucent medium 20. One end 24a of the optical fiber 24 is connected to a second end face 20b opposite to the first end face 20a. The optical fiber 24 upwardly extends from the end 24a through a bend 24b. Another end 24c is drawn on an upper face of a support board 18 parallel to a third end face 20c and a fourth end face of the translucent medium 20. A light outputted from the arbitrary electric wiring board 14 enters into the translucent medium 20, is reflected by the reflection part 22 and outputted to other electric wiring boards 14 through other optical fibers 24. COPYRIGHT: (C)2003,JPO
Bibliography:Application Number: JP20010360899