SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor device to improve the adhesive property between a package and a housing, and being capable of improving moisture proofness. SOLUTION: The semiconductor device 11 is provided with a housing 12 made of polyphenylene sulphide, a package 13 made of liquid...

Full description

Saved in:
Bibliographic Details
Main Authors TAJIMA KIYONARI, HORIBE MASARU
Format Patent
LanguageEnglish
Published 09.05.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device to improve the adhesive property between a package and a housing, and being capable of improving moisture proofness. SOLUTION: The semiconductor device 11 is provided with a housing 12 made of polyphenylene sulphide, a package 13 made of liquid crystal polymer is formed in the internal part thereof, and resin burrs 13a and 13b are formed at the package 13. The resin burr 13a is formed in a given thickness in a manner to protrude toward the housing 12 side from an outer peripheral edge on the same plane as a surface on which a lead terminal 14a is situated. The resin burr 13b is formed in a given thickness in a manner to cover the base end peripheral edge of the lead terminal 14a. After the resin burrs 13a and 13b are molten when the package 13 is insert-molded in the housing 12, the burrs are cured. The lead terminal 14a is situated at one side of the housing 12 in a manner to extend in a protrusion state.
Bibliography:Application Number: JP20010332600