VACUUM DEPOSITION APPARATUS AND VACUUM DEPOSITION METHOD

• Main Authors: KONDO YUKIHIRO, MATSUMOTO EIICHI, NISHIMORI TAISUKE, NAKAGAWA TERUO, KIDO JUNJI, KISHI YASUO, YANAGI YUJI
• Format: Patent
• Language: English
• Published: 08.05.2003
• Edition: 7
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a vacuum deposition apparatus wherein a substrate can be vapor-deposited in a uniform film thickness, and optionally the substrate can be vapor-deposited in a film thickness having an intentional thickness distribution. SOLUTION: The vacuum deposition apparatus is th...