VACUUM DEPOSITION APPARATUS AND VACUUM DEPOSITION METHOD

• Main Authors: KONDO YUKIHIRO, MATSUMOTO EIICHI, NISHIMORI TAISUKE, NAKAGAWA TERUO, KIDO JUNJI, KISHI YASUO, YANAGI YUJI
• Format: Patent
• Language: English
• Published: 08.05.2003
• Edition: 7
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a vacuum deposition apparatus wherein a substrate can be vapor-deposited in a uniform film thickness, and optionally the substrate can be vapor-deposited in a film thickness having an intentional thickness distribution. SOLUTION: The vacuum deposition apparatus is the one wherein a vaporization source 2 and a substrate 3 are set within a vacuum deposition chamber 1, and the space between the source 2 and the substrate 3 is surrounded with a cylinder 4 heated to the temperature at which the substance as the source 2 can be vaporized so that the substance vaporized from the source 2 may reach the surface of the substrate through the cylinder and may be deposited on the surface. The cylinder 4 is provided with a control member 8 that guides and controls the transfer of the vaporized substance 31 to the side of the substrate 3 in the cylinder 4. The distribution of the deposition of the vaporized substance 31 on the substrate can be controlled with the control member 8.