SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent an element from being broken when large thermal stress operates on a semiconductor device, and to improve long-term reliability in the semiconductor device. SOLUTION: A semiconductor device 1 is equipped with a semiconductor chip 2 and a pair of heat sinks 3 and 4 fo...

Full description

Saved in:
Bibliographic Details
Main Authors HIRANO NAOHIKO, TEJIMA TAKANORI, NAKASE YOSHIMI, MASAMITSU KUNIAKI, YAGI KENJI, OKURA YASUTSUGU, FUKUDA YUTAKA, NOMURA KAZUHITO
Format Patent
LanguageEnglish
Published 11.04.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To prevent an element from being broken when large thermal stress operates on a semiconductor device, and to improve long-term reliability in the semiconductor device. SOLUTION: A semiconductor device 1 is equipped with a semiconductor chip 2 and a pair of heat sinks 3 and 4 for radiating from both the surfaces of the semiconductor chip 2. Nearly the whole of the semiconductor device 1 is molded by resin 7. When the thickness of the semiconductor chip 2 is set to t1, and the thickness of at least one heat sink 3 in the pair of heat sinks 3 and 4 is set to t2, t2/t1>=5 should be satisfied. It is confirmed that element breakdown does not occur even if large thermal stress operates on the semiconductor device 1 by trial manufacture and experiments.
Bibliography:Application Number: JP20020196140