COPPER PLATING SOLUTION FOR EMBEDDING FINE WIRING AND COPPER PLATING METHOD USING THE SAME

• Main Authors: TOTSUKA TAKASHI, KUZUSHIMA TOSHIO
• Format: Patent
• Language: English
• Published: 09.04.2003
• Edition: 7
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a copper plating solution which is capable of performing a plating treatment of a wafer surface, as a surface to be plated, subjected to formation of fine wiring having spacings of a sub-μm level and coated with copper as a seed metallic film, so as to suppress disso...