TAPING METHOD FOR ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ASSEMBLY

PROBLEM TO BE SOLVED: To provide a taping method for electronic components, by which built-in components of a semiconductor element, such as CSP (chip size package), QFP (quad flat pack), BGA (ball grid array), etc., are transported, stored, or supplied to an electronic component mounting machine in...

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Bibliographic Details
Main Authors FUJIYAMA MASAZO, NOMI TAKUMI
Format Patent
LanguageEnglish
Published 03.04.2003
Edition7
Subjects
ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS
CONVEYING
HANDLING THIN OR FILAMENTARY MATERIAL
MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS
PACKAGES
PACKAGING ELEMENTS
PACKING
PERFORMING OPERATIONS
STORING
TRANSPORTING
UNPACKING
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Summary:PROBLEM TO BE SOLVED: To provide a taping method for electronic components, by which built-in components of a semiconductor element, such as CSP (chip size package), QFP (quad flat pack), BGA (ball grid array), etc., are transported, stored, or supplied to an electronic component mounting machine in good condition, and moisture absorption by the sealing materials of the built-in components is prevented without fail, and to provide an electronic component assembly manufactured using the taping method. SOLUTION: A plurality of the built-in components 1 of the semiconductor element are subjected to a dry process individually. Then, each built-in component 1 is sequentially housed in each one of plurality of recessed housing parts 11a formed on the carrier tape 11 in the length direction at every a distance. Each housing part 11a is filled with an inert gas and sealed up, and a cover tape 12 is fixed so as to cover the opening of each housing part 11a in an airtight manner.
Bibliography:Application Number: JP20010286994