SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a reliable semiconductor device excellent in insulation characteristics and heat-resistance cycle property. SOLUTION: The semiconductor device comprises, at least, an insulating substrate, a plurality of metal plates disposed on the insulating substrate, and a semico...

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Bibliographic Details
Main Authors KIJIMA KENJI, HIRAMOTO HIROYUKI, MATSUMOTO HISAAKI, SEKIYA HIRONORI, SHIMIZU TOSHIO
Format Patent
LanguageEnglish
Published 20.03.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a reliable semiconductor device excellent in insulation characteristics and heat-resistance cycle property. SOLUTION: The semiconductor device comprises, at least, an insulating substrate, a plurality of metal plates disposed on the insulating substrate, and a semiconductor element disposed on the metal plates. It comprises: (1) a solid insulator which coats a gap between adjoining metal plates and a slit formed at the solid insulator: (2) the solid insulator which coats the gap between adjoining metal plates and a film, instead of the slit, which is not adhesive to the solid insulator: and (3) a thermo-setting elastomer which is a flexible rubber-like material and coats the gap between the adjoining metal plates.
Bibliography:Application Number: JP20010276580