SEMICONDUCTOR DEVICE AND FINGERPRINT DETECTOR

PROBLEM TO BE SOLVED: To provide a fingerprint detector which can be made smaller and thinner even when an opening to the outside, a memory device, and the like are provided, and to manufacture the device at a lower cost. SOLUTION: This fingerprint detector 101 has a fingerprint detecting device 1 a...

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Bibliographic Details
Main Authors KITAOKA KOKI, YASUDA MASAO
Format Patent
LanguageEnglish
Published 20.03.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
DIAGNOSIS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HUMAN NECESSITIES
HYGIENE
IDENTIFICATION
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
MEDICAL OR VETERINARY SCIENCE
PHYSICS
SEMICONDUCTOR DEVICES
SURGERY
TESTING
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Summary:PROBLEM TO BE SOLVED: To provide a fingerprint detector which can be made smaller and thinner even when an opening to the outside, a memory device, and the like are provided, and to manufacture the device at a lower cost. SOLUTION: This fingerprint detector 101 has a fingerprint detecting device 1 and a memory device 12 mounted in a package formed by combining an upper resin member 102 and a lower resin member 103. A fingerprint detecting portion 9 of the fingerprint device 1 is exposed from an opening 7 of the upper resin member 102 to detect the geometrical information of a fingerprint 20 and convert it into an electrical signal. When the geometrical information detected by the fingerprint detecting device 1 is compared with information stored in the memory device 12 beforehand, personal authentication or the like can be carried out by using a fingerprint 20. Since the fingerprint detecting device 1 and the memory device 12 are mounted in an integral package, this detector can be made smaller and thinner, and can be manufactured at a significantly lower cost than in the case where devices are separately mounted on a wiring board.
Bibliography:Application Number: JP20010272425