PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM USING THE SAME

• Main Authors: TAKAMIYA HIROYUKI, NAKAHARA KOICHIRO, HIUGA ATSUYOSHI
• Format: Patent
• Language: English
• Published: 14.03.2003
• Edition: 7
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in sensitivity, resolving power, adhesion of thin lines, flexibility as a resist, developing solution resistance, plating property and removability as a resist and to provide a dry film using the composition. SOLUTION: The photosensitive resin composition comprises (a) an unsaturated group-free carboxyl-containing polymer, (b) a functional polymer obtained by reacting an alicyclic epoxy-containing unsaturated compound with a carboxyl- containing polymer and having 0.3-3.5 mmol/g unsaturated groups (c) an ethylenically unsaturated compound and (d) a photopolymerization initiator and the dry film is obtained by using the composition.