PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM USING THE SAME

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in sensitivity, resolving power, adhesion of thin lines, flexibility as a resist, developing solution resistance, plating property and removability as a resist and to provide a dry film using the composition. SOLUTION: The...

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Bibliographic Details
Main Authors TAKAMIYA HIROYUKI, NAKAHARA KOICHIRO, HIUGA ATSUYOSHI
Format Patent
LanguageEnglish
Published 14.03.2003
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in sensitivity, resolving power, adhesion of thin lines, flexibility as a resist, developing solution resistance, plating property and removability as a resist and to provide a dry film using the composition. SOLUTION: The photosensitive resin composition comprises (a) an unsaturated group-free carboxyl-containing polymer, (b) a functional polymer obtained by reacting an alicyclic epoxy-containing unsaturated compound with a carboxyl- containing polymer and having 0.3-3.5 mmol/g unsaturated groups (c) an ethylenically unsaturated compound and (d) a photopolymerization initiator and the dry film is obtained by using the composition.
Bibliography:Application Number: JP20010272158