MULTILAYER PRINTED WIRING BOARD

• Main Authors: IGAI NORIHIKO, SUMI YASUSHI, KOJIMA TOSHIFUMI, OKUYAMA MASAHIKO
• Format: Patent
• Language: English
• Published: 07.03.2003
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To obtain a multilayer printed wiring board containing an electronic component which prevents a crack from occurring in an insulating layer laminat ed and formed on a through hole or a solder resist layer in a reliability evaluat ing test (particularly a thermal impact test of repeating cooling to -55 deg.C and heating to 125 deg.C), which improves electric characteristics by reducing a parasitic capacity and which lowers a back surface height. SOLUTION: The multilayer printed wiring board comprises a build-up layer having insulating layers and wiring layers alternatively laminated on at least one surface of a core board and openings and through-holes formed so as to pass through the core board and the build-up layer. In the substrate, an electronic component is disposed in the opening, and embedded by using the embedding resin. A cured material of a paste or filling in the through-hole having an absolute value of a difference of a thermal expansion coefficient of a thickness direction (Z-axis direction) of the core board of 20 ppm/ deg.C or lower is filled in the through-hole. An elastic modulus of the cured material of the paste at 25 deg.C is desirably in a range of 3.0 to 6.5 GPa.