METHOD OF FORMING MULTILAYERED FILM

• Main Authors: KAWACHI MASAHARU, YOSHIZAWA MASATO
• Format: Patent
• Language: English
• Published: 14.02.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; CONDUCTORS; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; INSULATORS; METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a multilayered film forming method which is capable of easily forming a superconductive film on a base of optional shape at a low cost without generating mutual diffusion. SOLUTION: This multilayered film forming method comprises a process of forming a diffusion preventing film on the surface of a base, a process of forming a high-temperature superconductor and/or high-temperature superconductor precursor on the diffusion preventing film by migration electrodeposition or electrolytic deposition, and a process of enabling the base to undergo thermal treatment to sinter the high-temperature superconductor and/or the high- temperature superconductor precursor for the formation of a superconductive film.