MANUFACTURING METHOD OF ELECTRONIC COMPONENT BUILT-IN TYPE MULTILAYER BOARD AND METAL CORE SUBSTRATE USED FOR THE METHOD

• Main Authors: YOKOYAMA HIROYOSHI, SAKURAI MASAYUKI, OZAWA YUICHI
• Format: Patent
• Language: English
• Published: 31.01.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a structure for an electronic component built-in type multilayer wiring board, that mounts electronic components to the inside compactly and with high density and has superior mechanical strength, heat radiating properties, and the like, and to provide a method for manufacturing the electronic component built-in type multilayered wiring board. SOLUTION: In an electronic component built-in multilayer circuit board, where a plurality of electronic components are laminated at the inside in a layer shape, and a method for manufacturing the electronic component built-in multilayer circuit board, a conductor wiring pattern (11) and a resin layer (12) are formed on the same surface on a metal core substrate (10), where an insulating layer (16) is formed on a metal base substrate (15), and an electronic component (20) is mounted on the conductor wiring pattern. A dam-forming member (30) is jointed to the periphery of the mounted electronic component (20), and a sealing member (40) is filled into the cavity (31) to be cured. After that, the dam-forming member and sealing members are cut and polished at specific height. Additionally, the above processes are repeated, and a desired number of insulating layers (L1 to L3), where the electronic components are accommodated in the layers, are laminated on the core substrate (10), thus manufacturing the multilayer board.