RESIN COMPOSITION, PREPREG AND LAMINATE USING IT

PROBLEM TO BE SOLVED: To provide a resin composition having low dielectric constant and low water absorption, a prepreg and a laminate. SOLUTION: The resin composition comprises (A1) an epoxy resin having a dicyclopentadiene skeleton and (B) a polybutadiene-modified phenolic resin. The prepreg is pr...

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Bibliographic Details
Main Authors TOBISAWA AKIHIKO, URATA YOSHITERU, EKUSA SHIGERU
Format Patent
LanguageEnglish
Published 24.01.2003
Edition7
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
GENERAL PROCESSES OF COMPOUNDING
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a resin composition having low dielectric constant and low water absorption, a prepreg and a laminate. SOLUTION: The resin composition comprises (A1) an epoxy resin having a dicyclopentadiene skeleton and (B) a polybutadiene-modified phenolic resin. The prepreg is produced by impregnating a substrate with the resin composition. The laminate is produced by laying one or more plies of the prepreg one upon another and hot-pressing them.
Bibliography:Application Number: JP20010208785