CURING ACCELERATOR FOR EPOXY RESIN AND LIQUID EPOXY RESIN COMPOSITION

• Main Authors: ISHIZAKI TATSUYA, OHASHI KENJI, MAEHARA SHINYA
• Format: Patent
• Language: English
• Published: 24.01.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a curing accelerator for an epoxy resin that has rapid curability and a novel liquid epoxy resin composition that is excellent in the balance between rapid curability and storage stability. SOLUTION: The curing accelerator for an epoxy resin comprises as an effective component a tetraphenylphosphonium tetra(4-methylphenyl) borate represented by formula (1). The epoxy resin composition having rapid curability can be produced, which comprises as the constitutional components of the composition (A) a curable epoxy resin, (B) an acid anhydride type curing agent having the action to cause curing of the epoxy resin and (C) the tetraphenylphosphonium tetra(4-methylphenyl)borate represented by formula (1).