CURING ACCELERATOR FOR EPOXY RESIN AND LIQUID EPOXY RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a curing accelerator for an epoxy resin that has rapid curability and a novel liquid epoxy resin composition that is excellent in the balance between rapid curability and storage stability. SOLUTION: The curing accelerator for an epoxy resin comprises as an effective...

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Bibliographic Details
Main Authors ISHIZAKI TATSUYA, OHASHI KENJI, MAEHARA SHINYA
Format Patent
LanguageEnglish
Published 24.01.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a curing accelerator for an epoxy resin that has rapid curability and a novel liquid epoxy resin composition that is excellent in the balance between rapid curability and storage stability. SOLUTION: The curing accelerator for an epoxy resin comprises as an effective component a tetraphenylphosphonium tetra(4-methylphenyl) borate represented by formula (1). The epoxy resin composition having rapid curability can be produced, which comprises as the constitutional components of the composition (A) a curable epoxy resin, (B) an acid anhydride type curing agent having the action to cause curing of the epoxy resin and (C) the tetraphenylphosphonium tetra(4-methylphenyl)borate represented by formula (1).
Bibliography:Application Number: JP20010210392