MULTILAYER SEMICONDUCTOR MODULE

• Main Authors: HOSOKAWA TAKAHARU, SHIMOE HIROSHI, OKUMURA NAOHISA, IMOTO TAKASHI
• Format: Patent
• Language: English
• Published: 10.01.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a multilayer semiconductor module in which warping, stripping of a flip-chip connected semiconductor chip and cracking of a thin semiconductor chip are prevented even when a unit package is multilayered three-dimensionally. SOLUTION: A plurality of unit packages 12 e...