APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR WAFER

PROBLEM TO BE SOLVED: To provide an apparatus and method for cleaning a semiconductor wafer, which can efficiently clean the peripheral part of a wafer on which polishing dusts are apt to adhere. SOLUTION: The apparatus for cleaning a peripheral edge E of a semiconductor wafer W includes a water dro...

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Bibliographic Details
Main Authors KAWAMOTO TOSHIRO, TANAKA TOMOYA, NAGAI KIYOSATO, SAEKI KOYO, MAEDA TAKESHI
Format Patent
LanguageEnglish
Published 10.01.2003
Edition7
Subjects
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
ATOMISING APPARATUS
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
NOZZLES
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
SPRAYING APPARATUS
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide an apparatus and method for cleaning a semiconductor wafer, which can efficiently clean the peripheral part of a wafer on which polishing dusts are apt to adhere. SOLUTION: The apparatus for cleaning a peripheral edge E of a semiconductor wafer W includes a water droplet flow ejection mechanism 3, which has a plurality of ejection nozzles 2. the nozzles are positioned at intervals of equal spacing, in the peripheral direction of the wafer W for blowing a water mist flow J, at a flow rate of 250 m/sec against a peripheral edge E of the wafer for its cleaning.
Bibliography:Application Number: JP20010194846