DIVIDED SEQUENTIAL EXPOSURE DEVICE

PROBLEM TO BE SOLVED: To maintain both of the positioning accuracy of a substrate and a mask in a next step and the exposure transfer accuracy of individual exposure patterns on the substrate at high accuracy and high reliability. SOLUTION: This divided sequential exposure device has a mask stage 1...

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Bibliographic Details
Main Author NAGAI SHINICHIRO
Format Patent
LanguageEnglish
Published 18.12.2002
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To maintain both of the positioning accuracy of a substrate and a mask in a next step and the exposure transfer accuracy of individual exposure patterns on the substrate at high accuracy and high reliability. SOLUTION: This divided sequential exposure device has a mask stage 1 which is arranged to face a substrate W held on a work stage 2 and holds the mask M smaller than the substrate, an illumination optical system 3 which irradiates the substrate W with the light for pattern exposure from above the mask M, a stage feed mechanism 7 which moves the work stage 2 stepwise in a step direction, a lesser interferometer 743 which detects the feed error in the step direction by the stage feed mechanism 7 and mask temperature regulating means 203 and 204 which regulate the temperature of the mask M by blowing an air current to the mask M, and is provided with a controller 300 which stops the blowing of the air current from the mask temperature regulating means 204 in detecting the feed error of the lesser interferometer 743.
Bibliography:Application Number: JP20010177696