EXPOSURE PROCESS MANAGING SYSTEM, METHOD THEREFOR AND PROGRAM FOR MANAGING EXPOSURE PROCESS

PROBLEM TO BE SOLVED: To manage overlay accuracy in an exposure process for manufacturing a semiconductor while considering changes with time. SOLUTION: In an exposure process, a prescribed pattern is exposed on a piece of wafer using a first aligner and a second aligner. Deviation is generated on t...

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Bibliographic Details
Main Authors TAKEUCHI KAGEHARU, NAKAGAWA TAIRA, YUKI HIDEAKI, ISHIBA TERUAKI, AKAMI YUTAKA
Format Patent
LanguageEnglish
Published 13.12.2002
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To manage overlay accuracy in an exposure process for manufacturing a semiconductor while considering changes with time. SOLUTION: In an exposure process, a prescribed pattern is exposed on a piece of wafer using a first aligner and a second aligner. Deviation is generated on the pattern exposed on the piece of wafer. An exposure process managing apparatus includes an inspection data storing section 32 for storing date and time when exposure process is executed and deviation amount, and an accuracy fluctuation detecting section 22 for determining whether or not a dispersion value of the deviation amount of a wafer processed during a first period is equal to a dispersion value of the deviation amount of a wafer processed during a second period, and allowing a display section 40 to display the fluctuation in the deviation amount when the deviation amounts are not equal.
Bibliography:Application Number: JP20010164323