LOW-DIELECTRIC ELECTRONIC MATERIAL AND RESIN COMPOSITION FOR THE SAME

PROBLEM TO BE SOLVED: To provide a low-dielectric electronic material having an excellent low-dielectric property with processability required for an electronic material, a sheet and laminated board composed of the material, and a production method of a polyarylate having the low-dielectric property...

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Bibliographic Details
Main Authors USAMI SUKEAKI, KUWANA YASUHIRO, SANTO YOSHINARI, DEMURA SATOSHI, YAMADA MASAO
Format Patent
LanguageEnglish
Published 13.12.2002
Edition7
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CONDUCTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
INSULATORS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a low-dielectric electronic material having an excellent low-dielectric property with processability required for an electronic material, a sheet and laminated board composed of the material, and a production method of a polyarylate having the low-dielectric property used as the material. SOLUTION: The low-dielectric electronic material comprises the polyarylate which consists of a residue of a dicarboxylic acid such as isophthalic acid and a residue of a dihydric phenol having a fluorene structure without having a bisphenol structure and/or an alkyl group and has a dielectric coefficient of below 2.0×10<-3> at 1 GHz. The production method of the same, a resin composition for an electronic material comprising the polyarylate and a thermosetting resin such as an epoxy resin with a compound having an active ester group as a curing agent, the low-dielectric electric materials comprising these resin compositions for an electric material and the sheet and laminated board comprising these low-dielectric electronic materials, are provided.
Bibliography:Application Number: JP20010274938