APPARATUS AND METHOD FOR BONDING

PROBLEM TO BE SOLVED: To provide a apparatus and a method for bonding which can prevent a positional deviation of a semiconductor device at the time of mounting the device on a semiconductor substrate. SOLUTION: One or more first suction ports 6 are provided on a mounting substrate 2 to fix the subs...

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Bibliographic Details
Main Author MARUSAKI TSUNEJI
Format Patent
LanguageEnglish
Published 29.11.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a apparatus and a method for bonding which can prevent a positional deviation of a semiconductor device at the time of mounting the device on a semiconductor substrate. SOLUTION: One or more first suction ports 6 are provided on a mounting substrate 2 to fix the substrate 2 by vacuum suction on a stage 1. A second suction port 7 is also provided to fix the semiconductor device 3 by vacuum suction to mount on the substrate 2 via a through hole 4 provided at the substrate 2 at the stage 1.
Bibliography:Application Number: JP20010148766