GLASS FORMING DIE

PROBLEM TO BE SOLVED: To provide a glass forming die which is capable of sufficiently promoting cooling of the die and makes the temperature distribution in the die under pressing uniform. SOLUTION: This glass forming die is obtained by joining copper or a copper alloy by welding to a matrix consist...

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Bibliographic Details
Main Authors YOSHIYAMA TAKESHI, WAKATSUKI HIROSHI, HANAI KOICHI, SHIMAZAKI TAKESHI
Format Patent
LanguageEnglish
Published 27.11.2002
Edition7
Subjects
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
GLASS
MACHINE TOOLS
MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
MINERAL OR SLAG WOOL
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To provide a glass forming die which is capable of sufficiently promoting cooling of the die and makes the temperature distribution in the die under pressing uniform. SOLUTION: This glass forming die is obtained by joining copper or a copper alloy by welding to a matrix consisting of steel to provide the matrix with a high-thermal conduction layer and further joining a low-thermal conduction layer having the thermal conductivity lower than the thermal conductivity of the high-thermal conduction layer onto the high-thermal conduction layer.
Bibliography:Application Number: JP20010145083