SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR

• Main Authors: KAWAI SUEO, KAJIWARA YUJIRO, SUZUKI KAZUNARI, NAITO TAKAHIRO, SUZUKI HIROMICHI, TSUBOSAKI KUNIHIRO, MIYAKI YOSHINORI
• Format: Patent
• Language: English
• Published: 15.11.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To eliminate chip placement failure due to the formation of burrs on the chip placement side of die pads of a lead frame. SOLUTION: In a semiconductor integrated circuit device wherein the size of the die pads of the lead frame 1 is larger than the size of a semiconductor chip,...