THIN HEAT PIPE, THIN HEAT SINK AND HEAT CONTROL SYSTEM, AND METHOD FOR MANUFACTURING THIN HEAT PIPE

PROBLEM TO BE SOLVED: To provide a thin heat pipe having high thermal transport efficiency, a thin heat sink employing the thin heat pipe and a heat control system, and a method for manufacturing the thin heat pipe. SOLUTION: The thin heat pipe 22, a laminate, has a structure in which two thin plate...

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Bibliographic Details
Main Author YABE NORIO
Format Patent
LanguageEnglish
Published 15.11.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
WEAPONS
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Summary:PROBLEM TO BE SOLVED: To provide a thin heat pipe having high thermal transport efficiency, a thin heat sink employing the thin heat pipe and a heat control system, and a method for manufacturing the thin heat pipe. SOLUTION: The thin heat pipe 22, a laminate, has a structure in which two thin plates 10, 12 located in the middle are enclosed by upper and lower thin plates 18, 20. The plates 10, 12 are provided with a plurality of holes 14, 16, respectively, at a given interval. Portions of the holes 14, 16 are blocked by adjacent thin plates, and the remaining portions are permitted to communicate with the holes of the other thin plate. Thus, the laminate as a whole constitutes a thin-tube channel 17 with all of the holes.
Bibliography:Application Number: JP20010134531