SOCKET FOR SEMICONDUCTOR PACKAGE CHARACTERISTIC MEASUREMENT, AND SEMICONDUCTOR PACKAGE CHARACTERISTIC MEASURING METHOD

PROBLEM TO BE SOLVED: To provide a socket for semiconductor package characteristic measurement, which can measure electrical property of a semiconductor package, even when a lead terminal taken out from the side edge part of the semiconductor package, has currently broken. SOLUTION: This socket for...

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Bibliographic Details
Main Author HONJO TAKAYUKI
Format Patent
LanguageEnglish
Published 31.10.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRICITY
LINE CONNECTORS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:PROBLEM TO BE SOLVED: To provide a socket for semiconductor package characteristic measurement, which can measure electrical property of a semiconductor package, even when a lead terminal taken out from the side edge part of the semiconductor package, has currently broken. SOLUTION: This socket for semiconductor package characteristic measurement is the socket for semiconductor package characteristic measurement, which has a package main part constituted by sealing a semiconductor element, and the lead terminals taken out from the side edge of the package main part. In it, it has a package receipt base for installing the above package main part, and it has the lead terminals taken out from the side edge part of the above package main part, and a probe for measurement, which can contact the side edge part, out of which the lead terminals are taken out from the above package main part.
Bibliography:Application Number: JP20010124845