ELECTRON EMISSION ELEMENT, MANUFACTURING METHOD OF ELECTRON SOURCE AND IMAGING DEVICE

PROBLEM TO BE SOLVED: To enhance stability of shape and thickness of a conductive film 3 formed by liquid dropping method, without applying any hydrophobic surface treatment on a base body 1, when manufacturing a desirable electron emission element with a base body 1, which is covered by an antistat...

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Bibliographic Details
Main Author YABU SHIGEKI
Format Patent
LanguageEnglish
Published 25.10.2002
Edition7
Subjects
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Summary:PROBLEM TO BE SOLVED: To enhance stability of shape and thickness of a conductive film 3 formed by liquid dropping method, without applying any hydrophobic surface treatment on a base body 1, when manufacturing a desirable electron emission element with a base body 1, which is covered by an antistatic film 6. SOLUTION: Prior to the formation of a conductive thin film 3, an opening 6a is formed at the area, to which the conductive thin film 3 is to be formed, and an antistatic film 6 is formed on the base board 1; moreover, when forming the conductive thin film 3, a liquid, containing material of conductive thin film, is applied as a liquid drop in the opening 6a at the antistatic film 6 formed on the base board 1; and the spread of the liquid drop is restricted by making a periphery of the opening 6a at the antistatic film 6 function as a bank.
Bibliography:Application Number: JP20010120762