WAFER UNLOADER

PROBLEM TO BE SOLVED: To provide a wafer unloader that can separate a buffer sheet from a wafer even if the buffer sheet adheres to the wafer and is unloaded with the wafer. SOLUTION: The wafer unloader 10 is composed of a case 11 for accommodating the wafer W while the buffer sheet S is being inter...

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Bibliographic Details
Main Author OTSUKA MASAHISA
Format Patent
LanguageEnglish
Published 11.10.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CONVEYING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING THIN OR FILAMENTARY MATERIAL
PACKING
PERFORMING OPERATIONS
PNEUMATIC TUBE CONVEYORS
SEMICONDUCTOR DEVICES
SHOP CONVEYOR SYSTEMS
STORING
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a wafer unloader that can separate a buffer sheet from a wafer even if the buffer sheet adheres to the wafer and is unloaded with the wafer. SOLUTION: The wafer unloader 10 is composed of a case 11 for accommodating the wafer W while the buffer sheet S is being interposed, a transfer arm 13 for successively unloading the wafer W and buffer sheet S from an upper open section 11A of the case 11, and a spray means 14 for separating the buffer sheet S that adheres to the wafer W from the wafer W. The spray means 14 includes plural nozzles 30, the direction of gas that is discharged from the nozzles 30 is set to a direction along nearly the tangential line of the case 11, and nearly eddy or spiral flow is formed in the space between the wafer W at the highest level and the next one.
Bibliography:Application Number: JP20010105409