INK SUPPLY TRENCH ETCHING TECHNIQUE FOR COMPLETELY INTEGRATED THERMAL INK-JET PRINTING HEAD

PROBLEM TO BE SOLVED: To provide a novel production technique for a printing head, capable of improving the resolution and the printing speed of a printing head. SOLUTION: A method for forming a printing apparatus comprises a step of providing a printing head substrate 20, a step of forming a polysi...

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Bibliographic Details
Main Authors HALUZAK CHARLES C, THOMAS DAVID R, VOOREN COLBY VAN, TRUEBA KENNETH E
Format Patent
LanguageEnglish
Published 03.10.2002
Edition7
Subjects
CORRECTION OF TYPOGRAPHICAL ERRORS
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:PROBLEM TO BE SOLVED: To provide a novel production technique for a printing head, capable of improving the resolution and the printing speed of a printing head. SOLUTION: A method for forming a printing apparatus comprises a step of providing a printing head substrate 20, a step of forming a polysilicon layer 44 on a first surface of the substrate, a step of forming a plurality of thin film layers 46, 48 on the first surface of the substrate, a step of forming an ink supply hole 26 through some of the thin film layers, a step of forming an orifice layer 28 on the thin film layers, a step of executing trench etching with a second surface of the substrate masked, a step of forming a trench by etching the second surface of the substrate using a wet etching solution, and a step of substantial self alignment to the ink supply hole formed completely through the thin film layers at the rim of the trench by wet etching of the thin film layers through the ink supply hole and in the part exposed by the trench.
Bibliography:Application Number: JP20020071598